Traditional bondtesting is being pushed to the limit by the reduction in wire bonding geometries and the development of stacked die configurations.

At pitches of less than 35 micron, a new generation of bondtester is required. The DAGE 5000 has been specifically designed to meet this challenge by addressing such issues as:

Lower range force measurement.
New load tool designs optimised to the changing shape of small geometry bonds and to overcome problems associated with the passivation layer thickness.
Soft landing and oscillating load tool for stacked die bondtesting.
Improved optics and illumination facilitatiing load tool alighnment and the grading of failure modes.
Improved shear height accuracy and repeatability.
Anti-vibration measures to maintain accuracy and optical performance within typical environmental conditions.
Improved control over sample manipulation under the test head.

KEY FEATURES

Low force/high resolution loadcartridgs
Borescope image system
Cavity Shear
'Quick Guard' load tools
Built-in anti-vibration mounts
Soft landing for stacked die applications
High precision sample manipulation