Dage 5000 Small Geometry Bondtester

To view the full Series 5000 Brochure please click here


Traditional bondtesting is being pushed to the limit by the reduction in wire bonding geometries and the development of stacked die configurations.

At pitches of less than 35 micron, a new generation of bondtester is required. The DAGE 5000 has been specifically designed to meet this challenge by addressing such issues as:

KEY FEATURES


Iso-Dynamique Microsystems