ISO-Dynamique Microsystems

Bondtester

Dage 4000 Multi-purposes tester

MULTI-PURPOSE BONDTESTER

The DAGE-SERIES-4000 is a modular Multi-Function Bondtester, capable of meeting all pull and shear applications. This system can be configured as a simple wire pull tester, and upgraded to provide ball shear, die shear or tweezer pull tests.

The 4000 uses the Dage Frictionless Patented Load Cartridge Systems and Air Bearing technology, to ensure maximum accuracy, repeatability, and reproducibility.

KEY FEATURES

Wire Pull to 10Kg; Tweezer Pull/Peel to 5Kg; Ball Shear to 250g, Solder Ball Shear to 5Kg; and Die Shear to 200Kg. (Dependant on the system configuration)
Each of the 8 standard test heads incorporate 4 default software selectable operating ranges, with a further six available on request
Internal SPC software to provide basic analysis
Fully ODBC compatible to exchange data with external Statistical Process Control systems
System control is provided through an external PC running Windows XP (Windows 2000, optional)
Additional options include Cold Bump Pull, Hot Bump Pull, Tape Carrier Pull, Stud Pull, Vectored Pull for CSP, and Autotesting for Fine Pitch Applications
XY movement in mm: 50 x 50, 160 x 160 & 240 x 240

Dage 5000 Ultra-FIne Pitch tester

Unrivalled Levels Of Bondtesting - Down to 25 Microns

At pitches of less than 35 micron, a new generation of bondtester is required. The DAGE-SERIES-5000 has been specifically designed to meet this challenge.

KEY FEATURES

Lower range measurement.
New loadtool designs optimised to the changing shape of UFP bonds and to overcome problems associated with passivation thickness.
Improved optics and illumination for easy alignment of loadtools to bonds and grading of failure modes.
Improved shear height accuracy and repeatability.
Anti-vibration measures to maintain accuracy and optical performance within typical environmental conditions.
Improved control over sample manipulation under the test head.
Easily adjustable optics mounting
Low force/high resolution loadcartridges
'Quick Guard' loadtools
Borescope image system
High precision X,Y sample manipulation
Anti-vibration mount
Cavity Shear

Dage 4300 Wafer Bump System

WAFER BUMP SYSTEM

The DAGE-SERIES-4300 is a new generation bondtester which complements Dage's proven semi-automatic wafer testers. It has been engineered in accordance with the strict standards of semiconductor foundries and subcontractors to meet the growing demand for handling and bump shear testing on 300mm wafers.

KEY FEATURES

Semi-automatic bondtesting of bumps on 300mm wafers
Joystick-controlled motorised 585mm x 300mm X,Y stage
Image capture option
Wafer size 200mm or 300mm
Provision for interface to customer's robot handler and other SMIF equipment

Dage 4000HS

High Speed Bondtesting

Solder ball joint integrity has always been an issue but never more so than with the introduction of lead-free solder. It has been noticed that lead-free joints can be particularly susceptible to brittle fracture at the ball to pad interface. Such failures occur over the full life cycle of a joint including manufacture, handling, test and end use. With the introduction of lead-free these failures are on the increase with many in the industry acknowledging that urgent attention is required. However, interest in brittle fracture is not limited to lead-free, it can be of equal concern with many solder alloys and pad surface finishes.

When shear testing at traditional speeds (less than 20mm/sec), the dominant failure mode tends to be "Solder Ball Shear". When this happens the only data available is that the bond strength is greater than that of the sheared solder ball. This makes it virtually impossible to compare the effects of different pad finishes and solder alloys. Extensive research has now proved that testing at much higher speeds (typically above 1000mm/sec if testing for potential brittle fractures) will produce many more bond failures allowing the performance of different pad finishes and solder alloys to be compared. A similar situation exists when pull testing (CBP) solder balls. In this case the test speed must be in excess of 500mm/sec to achieve the transition towards bond failures.
Suitable for : * Impact testing applications (as an alternative to 3 and 4 point bend testing and drop testing) * Brittle fracture joint failure analysis * Lead free solder ball joint evaluaton * Shear testing multiple ballbond simultaneously
Applications :
High Speed Shear The high speed test regime requires an area in which the tool can accelerate before contacting the ball. An automatic acceleration distance calculation "retraction" will take place based on the test speed setting.Sample preparation requires ball clearance. The optional force vs displacement function gives the user the ability to select both full and fractional energy to peak force (energy being the area under the F vs D curve expressed as a numerical value). As well as this the system will show the velocity of each test result with a further option to display a velocity curve for each test result.
High Speed Cold Bump Pull Pull testing at high speed also requires a different set up than conventional pull testing. Because the clamping jaws must have contact with the ball, an acceleration distance between the jaw and the sample is not possible. This is overcome by the use of a pneumatically controlled "rising" table, which accelerate the sample to the test speed setting.
High Power Zone Shear This is an alternative (optional) method to high speed shear testing. It involves shearing many solder balls in one pass of the shear tool. Either one row or many rows can be sheared simultaniously. This can be done at high speed typically 600mm/sec or at relatively low speeds such as 10mm/sec. High power zone shear requires a different XY stage to that supplied with the standard machine. Note: The DAGE-SERIES-4000 can also be upgraded to perform medium speed Zone Shear.