Compact 5 is an excellent choice when coating thickness measurement and material analysis applications demand high precision and versatility. Single, binary and ternary coating thickness applications are measured precisely and non-destructively. Coating thickness and alloy composition can be analyzed simultaneously. The compact chamber, together with an optimized X-ray beam geometry allows the use of very small collimators. A software controlled multiple-position collimator changer in conjunction with programmable. X-ray tube power provides versatility to adapt the system to almost any application.

A universal X-ray coating thickness measurement and material analysis system designed for the inspection of electronic components, PCB's and other precision metal finishing applications.

Compact 5 Key Features:

1. Efficient, highly reliable design for labor intensive production environment.
2. Alloy thickness and composition measurement for the precision metal finishing, microelectronics, and telecommunications industries.
3. Micro-mechanical collimation with optimized high voltage selection.
4. Substrate sorting by X-ray Assay (stainless steel and other ferrous and non-ferrous bases)

Maxxi 5 is the choice of metal finishing and microelectronics professionals when ultimate precision and versatility are required. Cost-effective and extremely simple to operate, the Maxxi 5 achieves reproducible, non-destructive measurements in only a few seconds. In addition to thickness and composition of multi-layer and alloy coatings, Maxxi 5 can analyze plating bath solutions and sort substrate alloy materials prior to plating.

The Maxxi 5 spacious chamber accommodates large and irregular parts. Adjustable chamber illumination assures sharp views of contoured, flat, dull or highly reflective samples. The Maxxi 5’s extended range programmable XYZ sample stage lets you create automatic measurement recipes, significantly enhancing throughput and tool capacity

Maxxi 5 Key Features:

1. Applications include general and precision metal finishing, substrate, component and device metallization for microelectronic systems
2. Stored application spectra deliver superior accuracy and calibration longevity
3. Automated computer controlled sample focusing ensures optimum reproducibility
4. Substrate sorting by X-ray Assay (stainless steel and other ferrous and non-ferrous alloy determinations)