ISO-Dynamique Microsystems

X-RAY

DAGE XD7600

Sub-Micron X-ray Inspection System

THE XiDAT DIGITAL ADVANTAGE WITH 70° OBLIQUE ANGLE VIEWS, SUB-MICRON RESOLUTION AND ACTIVE X-RAY IMAGE STABILISATION (AXiS)

XiDAT - X-ray integrated Digital Acquisition Technology

X-ray inspection is recognised as a vital step in the test regime of the PCB and semiconductor industries. Fault finding on current package designs is extremely demanding so X-ray systems must provide, as a minimum, high resolution, high magnification and high contrast X-ray images, at the largest and different angular views. Fast inspection throughput and user-friendliness are also essential when specifying an X-ray system. Dage’s XD7600 XiDAT X-ray system exceeds these requirements with its Dage Version 11 ‘Image Wizard’ software, sub-micron feature recognition, automated inspection, active vibration isolation, video capture, the most user-friendly operating system on the market and much, much more. By providing highly improved digital real-time x-ray images, enhanced resolution, extensive greyscale definition and oblique angle views of up to 70° , all as standard, new levels for the best investigation of joint quality can be assured.

Dage X-ray systems already provide as standard
The easiest to use X-ray systems in the industry
No complicated joystick controls
Intuitive ‘Point-and-Click’ operation
Oblique angle views without compromising the high magnification
Collision-free sample movement
Dage ‘Image Wizard’ operating software
Real-time digital X-ray inspection with XiDAT
16-bit image processing with live images at 25fps
Enhanced resolution X-ray images – 1.3M pixels
65,000 greyscale levels
Enhanced automated inspection routines
Automatic BGA and die-void measurements
Comprehensive data logging and reporting facilities
Uninterrupted rotating live oblique views 360° around any point in the sample
Maximum board size 20" x 17.5" (508 x 444 mm)
Maximum sample weight 5 kg
Windows XP operating system
Total radiation safety

The Dage XD7600 XiDAT X-ray system now provides in addition as standard

600 nm feature recognition
Up to 1400 X geometric magnification – avoiding any collision danger
AXiS– Active X-ray Image Stabilisation – unique to Dage - where image quality is improved by minimising vibrational interference, especially when operating in production areas, through air-suspension isolation of the entire system mechanical assembly.
Up to 70° oblique angle views over the entire inspection area
20" digital LCD monitor
Substantially smaller footprint

DAGE XD7500

Micro-focus X-ray Inspection System

THE XiDAT DIGITAL ADVANTAGE WITH 70° OBLIQUE ANGLE

XiDAT - X-ray integrated Digital Acquisition Technology

X-ray inspection is recognised as a vital step in the test regime of the PCB and semiconductor industries. Fault finding on current package designs is extremely demanding so X-ray systems must provide, as a minimum, high resolution, high magnification and high contrast X-ray images, at the largest and different angular views. Fast inspection throughput and user-friendliness are also essential when specifying an X-ray system. Dage's XD7500 XiDAT X-ray system exceeds these requirements with its Dage Version 11 "Image Wizard" software, < 2-micron feature recognition, automated inspection, video capture, the most user-friendly operating system on the market and much, much more. By providing highly improved digital real-time x-ray images, enhanced resolution, extensive greyscale definition and oblique angle views of up to 70° , all as standard, new levels for the best investigation of joint quality can be assured.

Dage X-ray systems already provide as standard
The easiest to use X-ray systems in the industry
No complicated joystick controls
Intuitive ‘Point-and-Click’ operation
Oblique angle views without compromising the high magnification
Collision-free sample movement
Dage ‘Image Wizard’ operating software
Real-time digital X-ray inspection with XiDAT
16-bit image processing with live images at 25fps
Enhanced resolution X-ray images – 1.3M pixels
65,000 greyscale levels
Enhanced automated inspection routines
Automatic BGA and die-void measurements
Comprehensive data logging and reporting facilities
Uninterrupted rotating live oblique views 360° around any point in the sample
Maximum board size 20" x 17.5" (508 x 444 mm)
Maximum sample weight 5 kg
Windows XP operating system
Total radiation safety

The Dage XD7500 XiDAT X-ray system now provides in addition as standard

< 2-micron feature recognition
Up to 1065 X geometric magnification – avoiding any collision danger
Up to 70° oblique angle views over the entire inspection area
20" digital LCD monitor
Substantially smaller footprint

FOCALSPOT Verifier HR FSX-090

The Verifier HR is an affordable high-resolution and high-magnification x-ray system designed for fast intuitive operation. The Verifier HRs' small 32x34" footprint design, ease-of-use and high-quality imaging makes it ideally suited for failure analysis and rework verification of PCBs up to 16x18" | 406x457mm

Specification / Other Handling Features

	90kV, 5 micron microfocus no-maintenance x-ray source, provides more than enough power to penetrate challenging packages such as: Ceramic Column Grid Arrays, BGA with metal lids or heat sinks and devices with RF shielding. High-resolution 2/4 Image Intensifier with zoom lens and CCD camera provides superb image quality with ultra clear resolution and contrast. Small footprint of 32x34" \| 813x864mm easily rolled to where ever needed (i.e., production floor, prototype lab, rework area, etc.) Greater than 650X magnification provides excellent viewing of internal semiconductor connections such as: wire-bonds, die-attach, delamination, voiding and solder joint opens. Systems are CE certified and exceed all safety and radiation protection requirements set forth by CDRH and FDA regulations.
	Sample Handling The standard sample manipulator has five angled set points, to provide angulations up to 30° or more depending on board size. Angular viewing provides improved detection of opens, non wets and void position. Extra Handling option is also available, see Other Handling features.
	Verifier Controls and Indicators Emergency OFF switch Safety Interlock Indicators ESD Ground strap terminal Keyed main power switch X-ray on/off switch X-ray: KV and mA controls Camera: Focus, zoom and gain controls
	Verifier X-Ray Imaging Train High-resolution 90kV 5micron x-ray source delivers more than enough power to penetrate challenging packages such as: Ceramic Column Grid Arrays, BGA with metal lids or heat sinks and devices with RF shielding. Sample Manipulator (Board Holder): Positions the sample in the x-ray path. Provides off axis positioning (tilt /rotate) of the sample between the source and detector High-resolution 2/4" Image Intensifier with zoom lens (Magnification: >650x) provides superb imaging for viewing internal semiconductor connections such as wire-bonds, die-attach, delamination, voiding and solder joint opens. Camera (lens optics and CCD Sensor): Converts analog light waves into digital video signals. The Image Processor (Computer, Frame Grabber and VIP software); captures and displays x-ray images in real-time while providing an operator with tools to enhance, identify, analyze, measure and report — sample quality and defect characteristics.

FOCALSPOT Verifier HR FSX-080

The Verifier FSX-080 is an ideal low-cost BGA/SMT QuickCheck™ solder verification and defect detection tool with a footprint of only 32x34". Designed for fast and intuitive operation, the Verifier provides continuous real-time x-ray solder verification, fundamental defect detection and failure analysis of PCB assemblies up to 16x18" | 406x457mm.

Specification / Other Handling Features

	The Verifier HR supports a broad range of failure analysis and inspection applications from general failure analysis to rework verification. Small footprint of 32x34" \| 813x864mm easily rolled to where ever needed (i.e., production floor, prototype lab, rework area, etc.) Greater than 200X magnification provides excellent viewing of the smallest SMD electrical interconnections. Systems are CE certified and exceed all safety and radiation protection requirements set forth by CDRH and FDA regulations.
	Sample Handling The standard sample manipulator has five angled set points, to provide angulations up to 30° or more depending on board size. Angular viewing provides improved detection of opens, non wets and void position. Extra Handling option is also available, see Other Handling features.
	Verifier Controls and Indicators Emergency OFF switch Safety Interlock Indicators ESD Ground strap terminal Keyed main power switch X-ray on/off switch X-ray: KV and mA controls Camera: Focus, zoom and gain controls
	Verifier X-Ray Imaging Train High-resolution 80kV 33micron no-maintenance microfocus x-y source provides continuous real-time inspection with a large (65mm) field-of-view (FOV) to quickly inspect solder quality of assemblies or rework operations. Sample Manipulator (Board Holder): Positions the sample in the x-ray path. Provides off axis positioning (tilt /rotate) of the sample between the source and detector High-resolution 2/4" image detector with zoom lens provides 200X magnification for detailed viewing of the smallest SMD electrical interconnections. While the large field-of-view can display (45mm) packages in a single view for rapid identification of bridges, missing, poor shape and large voids. Camera (lens optics and CCD Sensor): Converts analog light waves into digital video signals. The Image Processor (Computer, Frame Grabber and VIP software); captures and displays x-ray images in real-time while providing an operator with tools to enhance, identify, analyze, measure and report — sample quality and defect characteristics.