SAMPLE IMAGES using BGA-series
Magnification Resolution Video Format Stand Off Height Depth of View Focus depth Illumination
X70 to X140 H330/V350 lines NTSC/PAL 0.15 to 0.3mm 1 x 2 / 2 x 4mm 2.5 to 5mm LED
BGA-300 (With variable magnification x70 to 140) with Back Light System

The BGA-300 has all the features of the BGA-200 plus a continuously variable magnification from 70 - 140 times. This makes the BGA-300 a powerful inspection tool for BGA components offering a quick analysis of fault conditions or confirmation of suspected faults seen by xray equipment. The variable magnification allows optimum image quality to be obtained easily.
The composite video signal from all microscope versions can be linked to a frame grabber for creating a picture library
Magnification Resolution Video Format Stand Off Height Depth of View Focus depth Illumination
X70 H330/V350 lines NTSC/PAL 0.3mm 2 x 4mm 12mm LED
BGA-200 with Back Light System

The BGA-200 is the same size but uses a fixed magnification of times 70 which remains constant throughout the focus range. The combination of fixed magnification and greater focal length allows the BGA200 to provide a longer viewing distance underneath BGA components, more balls can be inspected in detail. When used with the powerful fibre optic back light even more underside detail is revealed. Identification of BGA faults becomes easy and fast - misalignment, solder bridging, solder balls, no reflow, etc etc....the majority of conditions can easily been seen by using the BGA-200 and fibre optic back light combination.

Options include : Back light - fibre optic or LED, 1mm prism, support stand and XY table.
Magnification Resolution Video Format Stand Off Height Depth of View Focus depth Illumination
X130 H330/V350 lines NTSC/PAL 0.2mm 1 x 2mm 2.5mm LED
BGA-100 with Back Light System

BGA-100 is designed with special lens technology with magnification of times 130. Optional 1mm thick prism combined with white LED through the lens illumination allows easy image capture even when components are positioned closely together. The back light option makes checking for BGA faults and viewing underneath components very simple & easy. BGA-100 is also very good for viewing QFP and any other smt or conventional components.
All back lights and BGA-100 series microscopes can be fitted with 1mm prisms for minimum space applications.
All BGA-100 series tools are supplied complete (Except monitor) with all necessary cables, power supply adapter, 2mm prism, straight lens, cleaning cloth and manual.

Handheld Camera Inspection Tool
SMT
In-Line - SS15000-PAL, SS15000-IL & SS20000-PAL

Fully automated inline AOI incorporating optical alignment to on-board fiducials maintaining positional accuracy from board to board.
Faults reported to panel and board position. All faults can be stored with pictures for use with Scanspections Rework Software. Full fault classification facility for SPC analysis comes as standard. ScanSpections simple programming and user interface ensures that high quality programs can be quickly and easily created for production

This user friendly operator interface is so simple to use that training can be carried out in less than 30 minutes.
Automatic scanner adjustment removes the possibility of operator error as well as dramatically reducing set up times. A simple Green pass and Red fail quickly indicates suspect devices. The review mode allows closer examination and classification on the devices with the option of collecting the information for full SPC analysis.

The “Operator” environment Interacts with the rework server allowing offline rework for high volume applications.

Isodynamique Group of Company (All rights reserved)
Automated Optical Inspection (AOI)

YesTek

First Article Inspection -The FA-Inspector is a scanner-based optical inspection system used to automate first article inspections and subsequent production inspection tasks without programming. The FA-Inspector has two primary modes of operation: Comparator Mode and AOI Mode. Both AOI and Comparator Modes generate comprehensive reports complete with error location marks, fault classifications including the full PCB image or XY layout for easy rework. Reports can be viewed, printed, saved or emailed to customers for rapid prototype review. Defect coverage includes, all SMT and PTH parts down to 01005, part presence/absence verification, part polarity and pin #1 orientation, part position and skew errors, laser marking, wrong part and device differences such as: labels and colour variations.

The CAD import facility requires only basic placement Information such as Ref ID, Part No, Package Type, X, Y and rotation. Any adjustments to scaling, rotation, polarity and positioning can be adjusted using the correct fields in the CAD exchange file. An enhancement to this feature is the BOM comparison tool which allows you to import either the CAD or Pick and place info and then compare that information to the electronic BOM.

A file will then be created with any errors between the XY and BOM files, and an import file will also be created with the merged information, automatically making the perfect document for First Article Inspection

The layout viewer is another simple but very effective electronic tool that ensures that the inspection is being carried out is correct to not only to the BOM and XY Positions, but also polarity enabled devices have been placed in the correct orientation.

The software simultaneously displays the layout position and the position on the actual board, displaying the correct orientation and pin 1 position.

The PDF or JPG of the layout is loaded into the software, the XY information is then overlayed so that the actual board and the Layout file are the same size.


Automated Optical Inspection - The economic realities of quality control, rework cost and need for customer confidence make Automated Optical Inspection (AOI) a necessity in Circuit Board manufacturing environments AOI can take a number of roles on the PCB production line. There are a number of “captive” applications such as accurate component positioning in the pick and place system, or screen checking in the paste printer, and there are also stand-alone functions to which AOI is ideally suited.

YesTek ScanSpection AOI uses two basic algorithm groups to inspect component and soldering. The first algorithm checks the component related parameters at once, with these being entered to a Model training phase. The second algorithm group is for solder and lead inspection and offers the ability to use the optimum algorithm for the type of inspection to be carried out. In addition the solder inspection and lead inspection can be attached to a package type rather than component type to assist in programming.

Drawer Assembly - SS15000-FA

Desktop AOI using the same high performance scanner and software features of the In-Line ScanSpection AOI. The board is loaded and unloaded using the drawer facility allowing the operator to place the board on predefined blocks. The positional accuracy of the board is not critical as the fiducial alignment of the board ensures test repeatability.