High-resolution 75, 90 or 130kV no-maintenance
x-ray source options provide outstanding
configuration flexibility.
The "no clamp" sample tray provides
quick loading and unloading of samples.
While
the 6-Axes sample manipulation provides
off-axis
sample manipulation to reveal shape, size
faults, etc. of electrical solder connections.
This is especially important with double-sided
boards, where top and bottom side components
may obscure clear viewing of object details.
High-resolution 2/4 Image Intensifier with
zoom lens (Magnification: >600x) provides
superb imaging for viewing internal semiconductor
connections such as wire-bonds, die-attach,
delamination, voiding and solder joint
opens.
The Image Processor (Computer, Frame Grabber
and VIP software); captures and displays
x-ray images in real-time while providing
an operator with tools to enhance, identify,
analyze, measure and report ¡ª sample quality
and defect characteristics.
Controls and Indicators
Emergency Off switch
Safety Interlock Indicators
ESD Ground strap terminal
Keyed main power switch
X-Ray On/Off switch
X-Ray KV and mA controls
Camera 2/4" I.I., zoom and gain controls
Image Intensifier (2" or 4")
Z1 (Up/Down) II
Rotate (CW or CCW) Rotation Fixture
Z2 (Up/Down) Tube
F-Stop (Open - Close) Camera Aperture
Tilt (Left - Right) Tube and II
Unique no-clamp sample tray
Sample Handling
The system is capable of handling large bare
or populated PCB assemblies up to 20-inches
by 24-inches or individual component packages.
Off-axis inspection is accomplished by
rotating
the x-ray source and detector around the
sample tray, hence no need for clamping
of
the samples.
The high-resolution high-magnification imaging
train provides crystal clear images for
the
analysis of virtually any board, assembly
or part, including near microscopic interlayer
electrical interconnection inspection of
wirebond and die-attachments.
Isodynamique Group of Company (All rights
reserved)
Quality Inspection Applications
Failure Analysis
Bare and Assembled PCBs
Components and Trays
Rework Verification
Counterfeit Device Screening
Manufacturing Process Verification
The Insight 130(FSX-6130) is a high-resolution,
high-magnification, high-power, ultra small-footprint
multi-axes x-ray inspection system with outstanding
configuration flexibility, unparalleled operator-friendly
ergonomic design and unique no-clamp sample
tray for fast load and unload.
60% larger board handling than similar sized
systems.
Modular Design: Adaptable, upgradable and
expandable (30 configurations)
Compact Footprint: 48" X 52" x
75" (L x W x H)
130kv microfocus x-ray tube for detect defect
in high density materials
